Hello,
I am designing a custom board for a fanless, high-temperature enclosure. I notice the RoboDesigner allows for custom board shapes, but I have a few questions about integration with thermal solutions:
1. Board Cutouts: Is it possible to define non-rectangular internal cutouts (e.g., for specific heat pipe routing or mounting standoffs) within the Layout Designer, or are custom shapes limited to the outer perimeter?
2. Heatsink: Is the standard heatsink attached to the CoM considered when generating the 3D CAD models (DXF/STEP)? What are the options for specifying a custom, taller heatsink (e.g., a skived fin or vapor chamber solution) that interfaces with the base module, and are there tools to model the mechanical constraints of such a custom component?